DDR-C300S8G32
Memory Module
> Curved gold finger to ensure stable installation and signal transmission.
> Reliable quality and lifetime warranty.
> Highly compatible; supports mainstream platforms such as Intel and AMD; plug-and-play
Technical
Product Model
DHI-DDR-C300S4G26
DHI-DDR-C300S8G26
DHI-DDR-C300S16G26
DHI-DDR-C300S32G26
Capacity
4 GB
8 GB
16 GB
32 GB
Type
SODIMM
Applicable Model
DDR4 laptop
Voltage
1.2 V
CAS Latency
CL19
Operating Frequency
2666 MHz
Number of Pins
260
Operating Temperature
0 °C to +70 °C (+32 °F to 158 °F)
Storage Temperature
20 °C to +85 °C (-4 °F to +185 °F)
Operating Humidity
25%–85% (non-condensing)
Warranty
Lifetime
Product Dimensions
69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①
Packaging Dimensions
165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")
Net Weight
8.5 g (0.02 lb)
Gross Weight
36 g (0.08 lb)
Reference Information
Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.Technical Specification
Technical
Product Model
DHI-DDR-C300S4G32
DHI-DDR-C300S8G32
DHI-DDR-C300S16G32
DHI-DDR-C300S32G32
Capacity
4 GB
8 GB
16 GB
32 GB
Type
SODIMM
Applicable Model
DDR4 laptop
Voltage
1.2 V
CAS Latency
CL22
Operating Frequency
3200 MHz
Number of Pins
260
Operating Temperature
0 °C to +70 °C (+32 °F to 158 °F)
Storage Temperature
20 °C to +85 °C (-4 °F to +185 °F)
Operating Humidity
25%–85% (non-condensing)
Warranty
Lifetime
Product Dimensions
69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①
Packaging Dimensions
165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")
Net Weight
8.5 g (0.02 lb)
Gross Weight
36 g (0.08 lb)
Reference Information
Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.Technical Specification
Technical
Product Model
DHI-DDR-C300U4G26
DHI-DDR-C300U8G26
DHI-DDR-C300U16G26
DHI-DDR-C300U32G26
Capacity
4 GB
8 GB
16 GB
32 GB
Type
UDIMM
Applicable Model
DDR4 desktop
Voltage
1.2 V
CAS Latency
CL19
Operating Frequency
2666 MHz
Number of Pins
288
Operating Temperature
0 °C to +70 °C (+32 °F to 158 °F)
Storage Temperature
20 °C to +85 °C (-4 °F to +185 °F)
Operating Humidity
25%–85% (non-condensing)
Warranty
Lifetime
Product Dimensions
69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①
Packaging Dimensions
165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")
Net Weight
16 g (0.04 lb)
Gross Weight
44 g (0.10 lb)
Reference Information
Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.Technical Specification
Technical
Product Model
DHI-DDR-C300U4G32
DHI-DDR-C300U8G32
DHI-DDR-C300U16G32
DHI-DDR-C300U32G32
Capacity
4 GB
8 GB
16 GB
32 GB
Type
UDIMM
Applicable Model
DDR4 desktop
Voltage
1.2 V
CAS Latency
CL22
Operating Frequency
3200 MHz
Number of Pins
288
Operating Temperature
0 °C to +70 °C (+32 °F to 158 °F)
Storage Temperature
20 °C to +85 °C (-4 °F to +185 °F)
Operating Humidity
25%–85% (non-condensing)
Warranty
Lifetime
Product Dimensions
69.6 mm × 30 mm × 3.58 mm (2.74" × 1.18" × 0.14")①
Packaging Dimensions
165 mm × 51 mm × 16.5 mm (6.50" × 2.01" × 0.65")
Net Weight
16 g (0.04 lb)
Gross Weight
44 g (0.10 lb)
Reference Information
Note: ①The thickness is calculated at the thickest point.
1. For different batches of products, memory chips of different brands and models will be used. All chips have been strictly tested to ensure quality. Chip brand and testing results of third-party softwares cannot be the basis for whether the product is genuine.
2. For products with the same capacity, there are 8 chips and 16 chips, which will be shipped randomly according to the inventory.
3. For memory modules of the same generation, the operating frequency is backward compatible. For example, the frequency of DDR4 includes 2400, 2666, 3000 and more. The memory module with the frequency of 3000 can be used in motherboards supporting 2666 or 2400 with lower frequency.
